Quartz Constant Temperature Bath, Qa Series; 16"W x 8"D x 9.8"L

Custom-configured product: Please request quote. Lab Equip will contact you for requirements.

• Type: Constant Temperature

• Material: Quartz

• Work Area Width: 8"

• Work Area Depth: 16"

• Unit of Measure: EA

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Terra Part # 9455-19

$11,233*

Usually ships in 5-5 business days

Want it faster ? Read about FasTrak

Terra Part #

$11,233*

Usually ships in 5-5 business days

Want it faster ? Read about FasTrak

Details & Specs

Features and Benefits

Dedication to Business Ethics

Terra is committed to conducting business according to the highest standard of professional ethics and conduct. To review Terra’s ethics code, please visit: https://www.terrauniversal.com/ethics-policy/

Complete Project Transparency

Terra is dedicated to complete transparency on project status, shipment tracking, and installation scheduling

Network of International Reps

Terra employs an international network of more than 20 local sales reps trained to provide comprehensive service on Terra's complete catalog of products

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Process Control, Safety, and Consistency

Polypropylene

Economical plastic with broad chemical compatibility
Ideal for wet processing station panels
Loses some chemical resistance at high temperatures
Suitable for HF and KOH processes

Quartz

The preferred material for ultra-pure applications
Provides greater uniformity in heat transfer than plastic baths—ideal for very tight temperature control
Suitable for most chemicals (but not HF acid)
Hard surfaces won’t scuff, stain, or absorb impurities

PVDF (polyvinyldilene fluoride)

Broader range of chemical resistance than polypropylene
Suitable for high process temperatures
Ideal for HF and BOE processes at high temperatures

PTFE (Teflon®)

Resistant to an extremely wide range of chemicals
Perfect for KOH and HF acid (which etch quartz)
Softer than quartz, so care must be taken to avoid scuffing, staining

Terra’s comprehensive range of constant-temperature baths, etching baths, dump risers, and other processing equipment is ideally suited for the high-purity requirements of the semiconductor industry. Microprocessor controls ensure the integrity of your operations.

The chart below indicates the baths best suited for common semiconductor operations. Once you select the equipment that meets your requirements, a Terra process engineer will help configure a turnkey solution.

Product Application Chart

Commercial or Generic Name	Process	Chemical Composition	Concentration	Typical Temperature	Recommended Product
Aqua Regia	Gold Etchant	Hydrochloric Acid (HCl) Nitric Acid (HNO₃)	75% 25%	90°	C Series
Buffered Oxide Etch (BOE)	Etch SiO₂	Ammonium Fluoride (NH₄F) Aqueous Hydrofluoric Acid (HF) Aqueous	40%	15-40°C Ambient	A Series RCe Series
CP8	Etch	Nitric Acid (HNO₃) Hydrofluoric Acid (HF)		Ambient	A Series
Etch (Indium) Molybdenum Platinum Nichrome	Etch	Hydrochloric Acid (HCl) Aqueous Nitric Acid (HNO₃)	37-38% 70-71%		QA Series
Metal Etch	Etch A, AlSi Al Si Cu	Phosphoric Acid (H₃PO₄) Acetic Acid (CH₃COOH) Nitric Acid (HNO₃)	85-87%	30-60°C	QA Series
Nitride Etch	Etch	Phosphoric Acid (H₃PO₄) DI Water (H₂0)	85-87% 15-13%	150-185°C	Nb Series
Organic Stripper	Resist Removal	PRS-1000 S-43 Lozolin No Phenol-922	Full strength	Room Temperature 120°C	Nb Series
Oxide Resist Strip	SiO₂ Resist Stripping	Sulfuric Acid (H₂SO₄) Ammonium Persulfate (NH₄S₂O₂)	95-96%		QA Series
Phenolic Stripper	Resist Removal	J100 Bermar 712D R-10		95-100°C	C Series
Resist Series (Metalized)	Resist Removal	Chromic Sulfuric Acid (CrO₃+H₂SO₄)			A Series
R.C.A. Clean	Pre-Diffusion Cleans Quartzware	Step 1: Water Hydrogen Peroxide (H₂O₂) Ammonium Fuoride (NH₄CH) Step 2: DI Water (H₂O) Hydrogen Peroxide (H₂O₂) Hydrochloric Acid (HCL)	40%	75-85°C	Qa Series
Silicon Etch	Etch	Acetic Acid (CH₃COOH) Nitric Acid (HNO₃) HydroFuoric Acid (HF)		Ambient	A Series
Sirtl Etch	Etch	Chromium Trioxide (CrO₃) DI Water (H₂0) Hydrofluoric Acid (HF)		Ambient	A Series
Slope Etch	Etch	Phosphoric Acid (H₃PO₄) Acetic Acid (CH₃COOH) Nitric Acid (HNO₃)		55°C	Qa Series
Standard Resist Strip (do not use w/aluminum)	SiO2 Resist Strip	Sulfuric Acid (H₂SO₄) Hydrogen Peroxide (H₂O₂)	95-96%	110-140°C	Qa Series
2:1 Etch	Etch	DI Water (H₂O) Hydrofuoric Acid (HF)		Ambient	A Series
Wafer Rinsing	Rinsing	DI Water (H₂O)	100%	Ambient	DR-Series

Quartz Constant Temperature Bath, Qa Series; 16"W x 8"D x 9.8"L

Features and Benefits

Dedication to Business Ethics

Complete Project Transparency

Network of International Reps

Terra Universal (714) 578-6016

Information & Resources

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