Wafer Dump Rinser, DR Series; 12"W x 11"D x 11.5"L
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• Dimensions of vessel ID: 12"W x 11"D x 11.5"L
• Material: Polypropylene
• Power: 105/125VAC, single phase 50/60Hz
• Ideal for DI water rinsing of wafers, masks, recticles and other semiconductor devices
• Adjustable DI water bleed-by eliminates "dead spaces"
• Innovative process capabilities include programmable initial and final-flow cascade
• Rinsing accomplished by multiple spray nozzles above and nitrogen and DI spray jets below
• Requires C15sa process controller at additional $847.00 (Cat.#7018-38)
• Electrical Specifications: None
• Weight, Shipping: 30 lb
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