Wafer Dump Rinser, DR Series; 16"W x 8"D x 7.5"L
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Summary
- Dimensions of vessel ID: 16"W x 8"D x 7.5"L
- Material: Polypropylene
- Power: 105/125VAC, single phase 50/60Hz
- Ideal for DI water rinsing of wafers, masks, recticles and other semiconductor devices
- Adjustable DI water bleed-by eliminates "dead spaces"
- Innovative process capabilities include programmable initial and final-flow cascade
- Rinsing accomplished by multiple spray nozzles above and nitrogen and DI spray jets below
- Requires C15sa process controller at additional $847.00 (Cat.#7018-38)
Specifications
Helena
• Electrical Specifications: None
• Weight, Shipping: 30 lb