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Part # 9505-02

Cleaning Systems; Ultrasonic, 4.1" dia., Barrel Reactor, 77° to 392°F, Ion trap, Plasma Preen, 120 V

  • Chamber dimensions: 4.1" diameter x 6.0"L
  • Utilities required: 120VAC, 60Hz power; Vacuum pump/gas supply (order Plasma Preen Gas/Vacuum
    Controller separately); water recirculation system (order separately)
  • Maintains low processing temperatures
  • Includes ion trap
  • WARNING: Oxygen service requires special pump preparation or explosion could result--specify pump No.7901-35 for use with oxygen
Stocked
Warranty: 90 Day Warranty
$7,667
Part #: 9505-02
Usually ships in 5-7 business days

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Product Details

  • Chamber dimensions: 4.1" diameter x 6.0"L
  • Utilities required: 120VAC, 60Hz power; Vacuum pump/gas supply (order Plasma Preen Gas/Vacuum
    Controller separately); water recirculation system (order separately)
  • Maintains low processing temperatures
  • Includes ion trap
  • WARNING: Oxygen service requires special pump preparation or explosion could result--specify pump No.7901-35 for use with oxygen
  • System uses microwave energy to generate a plasma cleaning medium
  • Safely removes organic and many inorganic contaminants from a wide range of components and
  • Substrates
  • Produces no significant effluent, eliminating waste disposal

Specs

• Maximum Temperature: 392°F

• Manufactured by: Plasmatic Systems, Inc.

• Model: Plasma Preen

• Temperature Range: 77° to 392°F

• Reactor Type: Barrel

• Diameter: 4.1"

• Unit of Measure: EA

• Electrical Specifications: 120 V, 1 Ph, 60 Hz

• Weight, Product: 60 Lbs

• Dimensions, Product: 24" W x 10" D x 15" H

• Weight, Shipping: 160 Lbs

• Dimensions, Shipping: 29"W x 20"D x 20"H

• Package Type: Box

  • Cleanroom Plasma-Preen Cleaner and Etcher Cleanroom Plasma-Preen Cleaner and Etcher
Cleanroom Plasma-Preen Cleaner and Etcher
Uses microwave energy (2.45 GHz) to clean contaminants from a wide range of components and materials Cleanroom Plasma-Preen Cleaner and Etcher Uses microwave energy (2.45 GHz) to clean contaminants from a wide range of components and materials, including semiconductors, ceramics and metals, without generating effluents or leaving residues.
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