As critical components become smaller and more sophisticated, their susceptibility to moisture damage increases.
Once absorbed by sensitive components, water creates a number of potentially disastrous conditions. Even minute traces of oxidation, the most notorious result of moisture exposure, can degrade soldering and other manufacturing processes. Because water dissolves ionic contaminants, it also alters the conductivity of the material, which in turn can degrade electrical function. Water also combines with other materials, causing harmful chemical reactions that degrade pharmaceutical samples and chemical mixtures.
"Popcorn Effect": Moisture Damage in IC Production
One particularly costly example of moisture-related damage is the "popcorn" effect that occurs during reflow soldering of IC packages.
This chart is intended as a general guide for various materials and chemicals. It shows some of the materials used in Terra’s products and chemicals likely to be used with them. Testing is strongly recommended for extreme conditions of use, such as prolonged exposure or immersion, high temperatures and high concentrations. The acids, caustics and salts in this chart are assumed to be in solution. Materials may react differently to the pure substances (glacial acetic acid, for example). See Terra Universal's line of plastic Desiccators.
Hazards (Only the primary ones are shown. For example, chlorine